Foundational Materials

Copper Clad Laminates & advanced materials

The materials beneath every circuit board — copper foil, glass fabric and resin pressed into copper clad laminates. Building these domestically is central to the T5 Concept.

The Material Foundation

What goes into a circuit board

Copper Clad Laminates (CCL)

The core substrate of every PCB — copper foil bonded to a glass-fabric-and-resin core. CCL quality directly determines board performance, making domestic capability strategically vital.

Copper Foil

Ultra-thin, high-purity copper foil forms the conductive layers of the laminate. A key imported input that the T5 chain aims to produce within India.

Glass Fabric

Woven glass fiber gives laminates their mechanical strength and dimensional stability across temperature and stress.

Resin Systems

Epoxy and high-performance resins bind the laminate and define its thermal and electrical behaviour.

Why it matters

Owning the materials means owning the outcome

India today imports much of its laminate and base materials. By developing domestic CCL and material capability, we reduce dependency, shorten lead times and gain control over the quality that everything downstream depends on.

Specialty materialsHigh-frequency, high-temperature and high-reliability grades for advanced applications.
Future material developmentInvesting in next-generation substrates as electronics demands evolve.
Supply chain integrationLinking materials directly to our PCB and assembly stages for seamless quality.

Copper clad laminate sheets and copper foil rolls