Multilayer PCB
Complex multi-layer stack-ups for dense, high-reliability designs. Precise registration, controlled impedance and robust interconnects for demanding electronic systems.
A complete portfolio of printed circuit board technologies — from multilayer and HDI to RF and defense-grade boards — built to international quality standards.
Each PCB technology is supported by dedicated engineering, process control and quality assurance — so you get the right board for your application, built right.
Complex multi-layer stack-ups for dense, high-reliability designs. Precise registration, controlled impedance and robust interconnects for demanding electronic systems.
High-Density Interconnect boards with microvias and fine-line geometries — maximising functionality in compact footprints for advanced and miniaturised products.
Signal-integrity-optimised boards with controlled impedance and careful material selection for high-frequency, high-data-rate applications.
Radio-frequency and microwave boards built on specialty substrates, engineered for low loss and stable performance across communication bands.
Boards designed for the thermal, vibration and reliability demands of automotive electronics, including powertrain, ADAS and the EV ecosystem.
Rugged boards for industrial automation, control systems and machinery — built for longevity in harsh operating environments.
High-performance boards for networking and telecom infrastructure, supporting bandwidth, density and thermal requirements of modern systems.
High-reliability boards engineered to stringent quality and traceability standards for defense and mission-critical electronics.

We support the full journey from design to populated, tested board — part of our broader push toward complete Electronics Manufacturing Services within the T5 chain.