A self-reliant electronics ecosystem is built on knowledge. Across six strategic areas — from the metals in the ground to the silicon at the heart of every device — we are developing the research, processes and partnerships India needs to make, not just assemble, its electronics.
Each area maps to a critical link in the T5 value chain — together they form a complete research agenda for India's electronics independence.
Advanced printed circuit board design and process research — multilayer, HDI, high-speed and high-reliability constructions. We study materials, stack-ups and fabrication techniques that push performance while building robust, repeatable domestic manufacturing.
Research into IC packaging substrates — the high-density interconnect layer that sits between the silicon die and the circuit board. Localising this know-how is essential for genuine semiconductor independence, and it is one of the most strategically important gaps in the chain.
Electrodeposited and rolled copper foil research — the conductive foundation of every laminate and the first metallurgical link in the board. We focus on foil quality, profile and reliability to support high-frequency and high-current applications made in India.
Assembly, Test, Marking and Packaging — the critical semiconductor back-end. ATMP is a high-value, achievable entry point for Indian capability, and our research targets the processes, yield and quality systems that make it globally competitive.
Sourcing and processing research for the base metals and minerals — copper, silica and specialty elements — that begin the electronics value chain. Securing responsible, traceable raw-material supply is where true "mine to mobile" integration starts.
Foundry and wafer-fabrication research — studying the processes, equipment and partnerships needed to bring front-end semiconductor manufacturing to India. The most ambitious link in the chain, and the ultimate destination of the T5 vision.
India can assemble electronics today. To design and manufacture them end to end, we have to build know-how at every layer — the materials, the substrates, the packaging and the silicon itself.
Our research program is deliberately spread across the full chain so that no single imported link can stall the whole system. It is long-term work, pursued with partners in industry, academia and government — and it is how the T5 Concept moves from blueprint to reality.
